The SixHex has been designed to truly compete against liquid cooled ATR units and perform the best within any external harsh and caustic environmental conditions (chemical, salt, sand and air-born particulates, etc).

The enclosed payload operates under a reduced internal thermal profile (approx. 45ºC less than a conventional ATR) thus significantly increasing MTBF by 10 times. Special techniques have been employed to decrease the issues imposed by thermal contact resistance between conduction card-edge and card-cage rail, a key limitation found in conduction cooled chassis. As a result, high power VPX boards (up to 150 W per slot) can be fully realized provided that total chassis power capacity is not saturated.

This series excellent thermal performance is attributed to its oversized cross flow heat exchangers that surround the floating card cage and has up to 3.6 m² of machined aluminum thermo-active interface surface material (5 times a conventional chassis area).

The new chassis internal recirculation airflow has been improved with regard its predecessor, top sealed CM series (Heat Exchanger Sidewalls). All these enhancements result in approximately 20ºC lower card rail temperature for the same payload, thus achieving four times greater MTBF than HES series.

CM have developed a stand alone single pack ATR with optimum trade offs between size/weight and dissipation capability. This makes the SixHex perfectly suited for either forthcoming system technologies or for high performance military self contained upgrades, retrofits and legacy systems.