Most VMEbus systems require intermixing of COTS boards, often with different mechanics and often supplied by several vendors. The CM chassis range offers up to three independent I/O wiring solutions and is capable of accommodating on a slot-by-slot basis any type of standard form-factor VMEbus module. This allows easy design of your application without limitations regarding board mechanics or I/O format. Wiring made easy Low Profile 6U chassis provide integrated J2 I/O routing across the backplane to an intermediate set of 50 pin D-type Cannons. Depending on application signal distribution, the user can fit specific I/O wiring from the Cannons to the chassis front panel circular connectors.
Universal card cage concept All CM chassis card cages can be user configured to accept any combination of conduction-cooled IEEE 1101.2 or air-cooled IEC-297 modules. The figure shows an array of wedgelock and front panel I/O boards. A practical sidewall I/O wiring corridor interconnects air cooled boards with the enclosure panel circular application connectors.
Outstanding 3U versions The 1/2 ATR 3U versions are ideal for cost-effective systems in which low weight and compact size are at a premium. The single/dual 3U backplane allows implemention of a single 10 slot system, a dual 5 slot master-slave redundant system, or two different 5 slot systems in the same chassis. 3U enclosures share the same design features displayed by 6U models.
Unlimited customized I/O The High Profile chassis, with its free space below the VME64 backplane, is ideal for housing I/O transition cards, signal connectors, complementary sub-buses (i.e. RACEway Interlink), or any type of user defined J0 and J2 I/O wire-wrapping.
Enhanced airflow distribution All VMEbus cards are oriented in parallel with the chassis side walls. Forced air flows around both sides of the modules and maintains a homogeneous flow rate per slot. Appropriate low restriction airflow holes are located on card cage slots and wiring corridors to allow air flow throughout the enclosure without obstruction. A set of removable cover plates allow optimum slot by slot airflow distribution and regulation. Cover plates are user fitted depending on number of boards, relative power dissipation, mechanical format, or other relevant considerations.
Superior cooling effectiveness Chassis cooling is based on the combination of conduction to the cool baseplate, enhanced natural convection and the high capacity fan assembly at the rear. This maximizes heat dissipation and provides low impedance thermal paths between the VME boards and the outside world.
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