| Serial channels: 16 independent full duplex channels.
|
| Serial controller (SCC): 8 industry standard Z-8530 or
Z-85230 chips @ 8-10-16-20 MHz. Each serial controller has two complete serial
ports. |
| Z-85230 features: Supports sync/async operation, on-chip
baud generator, HDLC/SDLC protocols, digital PLL, automatic CRC, etc. |
| Serial levels: All serial channels can be factory fitted
to operate at RS-232, RS-422, RS-423 or RS-485 EIA standard levels. |
| Serial signals: Support for TxD, RxD, CTS, RTS, DCD,
DTR, CLK-in and CLK-out per channel. |
| Serial transceivers: Accept a wide set of I/O devices in
all temperature ranges supplied by SIPEX, MAXIM, NATIONAL, LINEAR, etc. I.e.
MAX490, LTC490, SP490, SP485, MAX485, LTC485, DS3695, MAX238, HIN208, SP238,
DS14C238, etc. |
| Galvanic isolation: All serial channels optionally
support isolated I/O lines (> 1000 Vp), offering fully floating serial lines
with respect to other channels or VMEbus signals. |
| Front panel LEDs: 64 LEDs distributed with four LEDs per
channel which are illuminated when the RxD, TxD, CTS or RTS lines are active.
|
| Control Register: Activates the dual Built-In-Test
circuitry. |
| Built-In-Test: Dual independent wraparound BIT loop:
|
| |
TTL level Built-In-Test checks 100% of module TTL
chips. Disconnects SCC serial lines to/from the transceivers and interconnects
all serial channels amongst themselves in pairs. |
| |
Transceiver Built-In-Test determines any transceiver
failure. A set of BIT relays isolate serial signals from the application and
interconnects all serial channels amongst themselves. |
| RS-232/423 signals: Tx, Rx, CTS, RTS, DCD, DTR, 2xCLK.
|
| RS-422 signals: Tx, Rx, CTS, RTS. |
| RS-485 signals: Tx, Rx (full duplex); bidi AB (half
duplex). |
| VMEbus Interrupter: I(1-7). Manages IRQs from all SCCs.
|
| VMEbus Interface: A24/D08 (EO) Standard slave interface.
|
| VME Addressing: Two jumper blocks provide 256 mapping
options in the A24 range. |
| Power consumption: +5VDC @ 450 mA. (non isolated version) |
| Weight: 570 gr. C & I ver.; 770 gr. R+ & 883
ver. |
| Mechanical size: Single slot 6U (233.4x160 mm). |
| Mechanical format: |
| |
CM-IOC-40/A Classic IEC-297 mechanics for 19 inch
racks with I/O on front panel. |
| |
CM-IOC-40/B Military IEEE P1101 wedgelock mechanics
for ATR enclosures. |
| Humidity: Up to 95% RH non-condensing. |
| Altitude: Sea level up to 15 Km (50,000 ft.). |
| q |
-55 to +125 ºC ceramic
military ICs. |
q |
MIL-STD-810 E Temperature |
| q |
MIL-STD-883 FPGAs and TTL
chips. |
|
(Methods 501.3 & 502.3).
|
| q |
MIL-C-55302 Class I
Connectors. |
q |
MIL-STD-810 E Shock and
Vibrations |
| q |
MIL-R-39016 BIT Relays in 883
version. |
|
(Methods 516.4 & 514.4).
|
| q |
No signal PCB tracks in external
layers. |
q |
MIL-STD-810 E Saline Fog and
Dust |
| q |
MIL-E-5400 for avionics equipment
class 1B |
|
(Methods 507.3 & 509.3).
|
|
(Temperature and Altitude).
|
q |
Military Class V Printed Circuit
Board. |
TECHNICAL
SPECIFICATIONS
