| Relay version (isolated): 64 sealed relays.
SPST & SPDT contacts up to 300 V @ 1 Amp. |
| Optocoupler version (isolated): 64
optocouplers with 50VDC @ 100 mA output phototransistors. |
| Photo-MOS version (isolated): 64 photo-MOS
FETs. 400VDC/AC @ 150 mA bidirectional switch. |
| SSR version (isolated): 64 Solid State
Relays. Outputs rated for 10-280 VAC @ 1 Amp. |
| Power MOSFET version (common source): 64
N-channel open drain power MOSFETs. 400 VDC @ 1Amp. |
| Triac version (common MT1): 64 general
purpose Triacs rated for 400 VAC @ 1 Amp. |
| Thyristor version (common cathode): 64
P-gate SCRs rated for 400 VAC @ 1 Amp |
| TTL totem-pole version: 64 output gates. 60
mA sink. High speed FAST TTL compatible. |
| Open Collector version: 64 TTL gates with
open collector transistors up to 30 VDC @ 50 mA. |
| Open Collector version (+5 or +12 VDC pull-up): 64 open
collector transistors with 1 K (+5 V) or 2K2 (+12V) pull-ups. |
|
| Front panel LEDs: 64 LEDs. Illuminated when the
associated channel is driven ON. |
| Channel Program Register: Programs channel output
status. |
| Channel Status Register: Returns channel status and
closes Built-In-Test wraparound loop. |
| Power consumption: +5VDC @ 400 mA (channels OFF). |
| Weight (grams): |
| Military R+ & 883.- 800 gr. relays; 580 gr.
other. |
| Industrial.- 510 gr. relays; 430 gr.
other. |
| Mechanical format: |
| CM-DO-40/A.- Classic IEC-297 mechanics
for 19" racks with I/O on front panel. |
| CM-DO-40/B.- Military IEEE P1101
wedgelocks mechanics for ATR enclosures. |
| Humidity: Up to 95% RH non-condensing. |
| Altitude: Sea level up to 15 Km (50,000
ft.). |
| VMEbus interface: A24/D16 Standard slave
interface. |
| VMEbus addressing: Two jumper blocks provide
256 mapping options in the A24 range. |
| q |
-55 to +125 ºC ceramic
military ICs. |
q |
MIL-STD-810 D Temperature |
| q |
MIL-STD-883 TTL chips. |
|
(Methods 501.2 & 502.2).
|
| q |
MIL-C-55302 Class I
Connectors. |
q |
MIL-STD-810 D Shock and
Vibrations |
| q |
MIL-R-39016 Relays in MIL-883
version. |
|
(Methods 514 & 516). |
| q |
No PCB tracks in external
layers. |
q |
MIL-STD-810 D Saline Fog and
Dust |
| q |
MIL-E-5400 for avionics equipment
class 1B |
|
(Methods 507 & 509). |
|
(Temperature and Altitude).
|
q |
Military Class V Printed Circuit
Board. |
TECHNICAL
SPECIFICATIONS
