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CM-ATR-25/35/45 Card Cage Features
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Card-cage has dual unlimited I/O wiring capabilities per
slot both through the 20mm wiring clearance in the Top
Cover area and via the 35mm of clearance available
between the Backplane and the Bottom Cover.The high-profile top cover extends wiring clearance up to 35mm from the board front panel. Systems needing extra bottom wiring space (up to 50mm) may install the high profile Bottom Cover. (Ordering ref: HTC & HBC).
True military VME64x monolithic Backplane incorporates
active auxiliary electronics and is custom made to match
the enclosure mechanics. It is fitted with J0/J1/J2
Class 1 connectors.
Compact PCI monolithic Backplane is fitted with rear
panel I/O on P3, P4 and P5 connectors. It is designed to
match the enclosure mechanics & incorporates active
auxiliary electronics (Ordering ref: cPCI).
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Front Panel Features
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Cooling System Features
FAC & HES Versions. Extended capacity AC/DC high
altitude PX3/PX2 military fan assembly at the rear
provides direct or indirect cooling airflow up to 480
CFM. Fan input voltage is independent of Power Supply
input voltage.
HES
Versions. Rear panel can be supplied without fans and
specially adapted for vehicle air plenum or external
forced air applications. Note: requires customer
drawings. Chassis Front & Rear panels are removable for inspection & maintenance. The inside wall of the rear panel integrates the fans & Power Supply board constituting a single compact unit that significantly improves DC/DC heat dissipation. FAC & HES Versions. Rotron series PX2 & PX3 low profile standard fan finger guards are fitted in each fan ventilation opening to allow safe chassis manipulation. FAC & HES Versions. Shielded fan finger guards fitted with honeycomb filter improve chassis EMI and EMC performance in noise sensitive applications. (Ordering ref: EMIG) |
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EMI/EMC Features
All chassis panels & covers have conductive interior
surfaces and incorporate EMI O-ring gaskets in all
metal-to-metal joints to create an effective shielded
Faraday cage for the enclosed electronic payload. |
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A NAS6204 or metric M3 bonding point can be installed on the front panel to allow chassis external grounding. Additionally there are six specific M3 thread terminals fitted in the inside of the chassis structure for general grounding purposes. |
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Mechanical Features
As an
alternative to classis front panel NAS-622 steel hooks,
enclosure mounting/fixing to base easily accomplished
through a set of M4 fixing screws fitted at the chassis
base structure.
Enclosure sidewalls and rear panel are externally finned to decrease weight up to 50% without sacrificing mechanical performance. Fins also improve heat dissipation through free air natural convection.
HES
Versions. Heat Exchanger Top Cover has identical design
and operation as heat exchanger sidewalls, increasing
cooling performance by approximately 35% with respect to
the basic chassis model, (Ordering ref: HETC). |
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![]() All chasssis external surfaces are painted with a 3-layer military grade epoxy paint with primer (paint sample is supplied upon request). Most prevalent standard colours are Black(B) and Navy Grey (G). |
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![]() Define
Your Application ColourA wider variety of special paint colours such as Blue (BLU), Red (R), Green (GN), Army dark Earth (E), Platinum (PT), White (W) and Yellow (YW) are available upon request to suit specific applications. (Ordering ref: Colour Code). |
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About Us
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| ©2008 Copyright by CM Computer All Rights Reserved | |||