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Chassis Cooling Technique
At
CM we are convinced that each
application requires a different type of chassis, a
conclusion that led us to offer twelve
CM-ATR-X5
COTS versions allowing our customers to select
the optimum enclosure depending on predominant cooling
technique, number of slots and internal power
dissipation. |
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Four Off The Shelf Cooling Options Standard Sealed Low cost standard dry-air enclosure with inner fans for internal air re-circulation. Chassis generated heat is dissipated by a combination of cold-plate conduction, radiation and free-air convection through ambient air. This minimum maintenance option is ideal for low wattage applications where ambient air is laden with hostile or harmful contaminants. Available in size ½ ATR (CM-ATR-25/S), ¾ ATR (CM-ATR-35/S) & 1 ATR (CM-ATR-45/S). |
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Sealed With Extended Fins Ultimate self-dissipation sealed enclosure that also
incorporates internal air re-circulation fans. These
dry-air chassis are fitted with over-size cooling fins
on the top cover, rear panel ands side-walls in order to
maximise radiation and natural convection. Cold-plate
mounting is recommended. These low maintenance sealed
chassis are suitable for medium wattage military and
aerospace applications. Size options are ½ ATR
(CM-ATR-25/SEF), ¾ ATR (CM-ATR-35/SEF) & 1 ATR
(CM-ATR-45/SEF). |
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 Flowthrough
Air CooledNon-sealed chassis in which ambient air is directly forced over the electronic modules using rear mounted exhaust fans. This highly efficient thermal management technique is suitable for full PSU wattage applications. This type of chassis is a medium cost option that is available in three standard sizes ½ ATR (CM-ATR-25/FAC), ¾ ATR (CM-ATR-35/FAC) & 1 ATR (CM-ATR-45/FAC). |
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Optimum Cooling & Thermal Efficiency
Chassis side and rear walls are externally finned to
improve radiation and free-air convection. Our basic
Sealed unit achieves a total external surface of 1.5
times its equivalent size ¨flat surface box¨, a ratio
only exceeded by our Sealed Extended Fins version, with
a surface up to 3 times the ¨flat-box¨.
Our highest performance flag-ship chassis combines four
external heat exchangers with internal forced-air
cooling. These sealed units (HES), constitute the
unprecedented state-of-the-art reference for
conventional, self-dissipating chassis without needing
to resort to unpractical liquid-cooled alternatives.  Performance
CoolingCM enclosures exhibit superior intrinsic cooling performance irrespective of the application platform. However, the user can improve dissipation by providing effective conduction to the cold plate and facilitating optimum external and environmental conditions. The CM-ATR-X5 series successfully combines various cooling techniques to establish the maximum number of simultaneous thermal paths to the outside world. The outcome is a chassis family that achieves higher power dissipation, lower system card temperature and longer module MTBF than any other similar size and slot capacity unit on the market. |
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About Us
Customers
Contact CM
Ordering
Info |
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| ©2008 Copyright by CM Computer All Rights Reserved | |||
Military
enclosure heat management is a complex matter and is
affected by specific environmental factors and field
deployment limitations.
Common sealed enclosures have static air inside and
therefore are only conduction-cooled. CM
has strengthened this model by using internal
air-recirculation fans fitted on card-cage slots. These
drain away heat dissipated by the system electronics
towards the cooler metal walls of the enclosure.
Internal forced-air is crucial for the effective
deployment of systems installing fibreglass boards, but
also enhances dissipation of conduction cooled modules.