CM ATR SixHex Series
SIXHEX from CM Computer pushes the limits of sealed air-cooled ATR design to meet the demand for true high power COTS solutions that require greater speed and outstanding capabilities of board and components in the latest, most advanced military electronic systems.
VME, VPX & cPCI architecture performance of up to 150+ Watt per slot and 1.6KW per system can be cooled to 85ºC (at card edge) using a complex combination of cross-flow forced air convection and conduction that goes beyond any previous ATR design, thus setting a new benchmark in dry-air cooling standards.
Performance of the SixHex is optimised by a uP based Chassis Supervisory Unit (CSU) to monitor in real time all operational parameters such as PSU & Backplane voltages, currents, efficiency, temperatures, fan rotation, etc to maintain cutting edge performance and provide enhanced connectivity for remote diagnostics, maintenance and chassis operations.
Achievement
Expressly designed to compete against unpractical liquid cooled alternatives, this step forward in forced air-cooled dynamics delivers a single package ATR enclosure that weights less than 13kg (3/4 ATR) and provides significant advantages (including easy deployment and maintenance) over existing liquid cooled ATR units.This latest milestone from CM establishes a new president in heat dissipation. It breaks all limitations previously understood by ATR designers dealing with sealed self dissipating air-cooled chassis by achieving up to five times more active metal to forced-air contact surface than equivalent flat enclosures.
The SixHex is equipped to meet the most demanding parameters and performance markers in order to provide our customers with the most robust, powerful, advanced and reliable contaminant-free ATR enclosure available in the COTS market today.
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SixHex Thermal Characteristics
The SixHex has been designed to truly compete against liquid cooled ATR units and perform the best within any external harsh and caustic environmental conditions (chemical, salt, sand and air-born particulates, etc).The enclosed payload operates under a reduced internal thermal profile (approx. 45ºC less than a conventional ATR) thus significantly increasing MTBF by 10 times. Special techniques have been employed to decrease the issues imposed by thermal contact resistance between conduction card-edge and card-cage rail, a key limitation found in conduction cooled chassis. As a result, high power VPX boards (up to 150 W per slot) can be fully realized provided that total chassis power capacity is not saturated.
This series excellent thermal performance is attributed to its oversized cross flow heat exchangers that surround the floating card cage and has up to 3.6 m² of machined aluminum thermo-active interface surface material (5 times a conventional chassis area).
The new chassis internal recirculation airflow has been improved with regard its predecessor, top sealed CM series (Heat Exchanger Sidewalls). All these enhancements result in approximately 20ºC lower card rail temperature for the same payload, thus achieving four times greater MTBF than HES series.
CM have developed a stand alone single pack ATR with optimum trade-offs between size/weight and dissipation capability. This makes the SixHex perfectly suited for either forthcoming system technologies or for high performance military self contained upgrades, retrofits and legacy systems.
SIX Heat Exchangers
Working to achieve the best heat dissipation within the military ATR market
