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| Chassis Description | |
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| CM enclosures exceed the
requirements of MIL-STD-5400 & MIL-STD-16400 aerospace, airborne,
ground-mobile or naval applications. Our complete chassis range offers 8 different sizes and versions covering 6U applications of 1/2, 3/4 or 1 ATR of capacity. The 3U version is ideal for cost-effective systems up to 10 slots. We manufacture two chassis heights. Low Profile VME32 versions feature minimum size and weight. High Profile VME64 versions offer extended I/O capacity due to the additional 50 mm of free space below the backplane. |
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| Chassis Specification Guide | ||||||||
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| CM-RA-20 3U VME32 |
CM-RA-20 3U VME64 |
CM-RA-20 6U VME32 |
CM-RA-20 6U VME64 |
CM-RA-30 6U VME32 |
CM-RA-30 6U VME64 |
CM-RA-40 6U VME32 |
CM-RA-40 6U VME64 |
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| Size | ½ATR Long | ½ATR Long | ½ATR Long | ½ATR Long | ¾ATR Long | ¾ATR Long | 1ATR Long | 1ATR Long |
| Slots | 10 | 10 | 5 | 5 | 7 | 7 | 12 | 12 |
| Backplane | BP10L | BP10H | BP32L | BP64H | BP32L | BP64H | BP32L | BP64H |
| Width | 137,5 mm | 137,5 mm | 137,5 mm | 137,5 mm | 190,5 mm | 190,5 mm | 285 mm | 285 mm |
| Height | 227 mm | 277 mm | 227 mm | 277 mm | 227 mm | 277 mm | 227 mm | 277 mm |
| Depth | 450 mm | 450 mm | 450 mm | 450 mm | 465 mm | 465 mm | 495 mm | 495 mm |
| Weight | 6,1 Kg | 7 Kg | 5,8 Kg | 6,7 Kg | 6,5 Kg | 7,9 Kg | 10 Kg | 12 Kg |
| Power Sup | 1,2 | 1,2,3,4 | 1,2 | 1,2,3,4 | 2,3,4 | 2,3,4 | 4,5,6 | 4,5,6,7,8 |
| Sealed | ok | ok | ok | ok | ok | ok | ok | ok |
| Fans (CFM) | 1 (>50) | 1 (>50) | 1 (>50) | 1 (>50) | 1 (>50) | 1 (>50) | 2 (>200) | 2 (>200) |
| I/O def. ( *) | 163 + 5 | 273 + 5 | 163 + 5 | 273 + 5 | 264 + 5 | 378 + 5 | 408 + 5 | 568 + 5 |
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| (*) CM default panel I/O + power
pins. Custom front panel configurations are available upon request.
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| The CM line of
enclosures offers a better total solution, incorporating a wide range of
practical functionalities, innovations, details and options. All mechanical
parts have been carefully machined and computer optimized in order to decrease
weight without sacrificing mechanical performance. Functional details include a retractable handle for transport, rear panel fan finger guards, front panel LED indicators and reserved space for chassis identification plate, etc. |
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The removable front panel and top
and bottom covers simplify maintenance of circuit cards, power supply and
backplane I/O wiring. A set of integrated cooling fins throughout the outer sidewalls and rear panel greatly improves the chassis natural convection cooling effectiveness. Fan assisted versions have 2 or 3 oversized air-intakes. VMEbus cards are oriented in parallel with the chassis sidewalls. This forces air to flow around both sides of the module and maintain a homogeneous flow rate per slot. A set of removable cover plates allow optimum slot by slot airflow regulation. Cooling of sealed dry air versions is based on the combination of conduction to the cool baseplate and enhanced natural convection. |
| CM chassis offer up to 3
independent I/O wiring solutions and are capable of accommodating on a
slot-by-slot basis any type of standard form-factor VMEbus module. These
features allow easy design of your application without limitations regarding
board mechanics or I/O. The High Profile chassis, with its free space below the VME64 backplane, is ideal for housing I/O transition cards, complementary sub-buses or any type of user defined J0 and J2 I/O wire-wrapping. |
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| Power Supply | |||
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All power supplies are
full military class and incorporate new generation DC/DC converters with up to
90% efficiency. Nominal input voltages are115 VAC and 28 VDC according to
MIL-STD-704. Galvanically isolated output voltages are standard (> 500 VRMS). Outputs are also overvoltage and overcurrent protected, including thermal shutdown. High dissipation devices are integrated on the chassis rear panel structure for optimum cooling and superior MTBF. All units incorporate Power Fail Monitor and a dual line input voltage filter |
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| Power Supply Watts (*) | |||
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| Power Supply 1-150 W (+5 VDC @ 10 A // ±12 VDC @ 4A) | |||
| Power Supply 2-175 W (+5 VDC @ 15 A // ±12 VDC @ 4A) | |||
| Power Supply 3-200 W (+5 VDC @ 20 A // ±12 VDC @ 4A) | |||
| Power Supply 4-250 W (+5 VDC @ 30 A // ±12 VDC @ 4A) | |||
| Power Supply 5-300 W (+5 VDC @ 40 A // ±12 VDC @ 4A) | |||
| Power Supply 6-400 W (+5 VDC @ 60 A // ±12 VDC @ 4A) | |||
| Power Supply 7-450 W (+5 VDC @ 60 A // ±12 VDC @ 6A) | |||
| Power Supply 8-500 W (+5 VDC @ 60 A // ±12 VDC @ 8A) | |||
| (*) 3.3 VDC @ 5A available on all models | |||
| VMEbus Backplane | |
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| CM ATR enclosures are supplied with leading-edge fully compatible VMEbus backplanes. Backplane PCBs are monolithic, low noise, with two dedicated ground shielding layers and standard passive resistive terminators. | |
| J0, J1
and J2 connectors are military class I according to MIL-C-55302. VME64 backplanes fitted with 5 row connectors are installed in High Profile chassis. VME32 backplanes fitted with 3 row connectors are installed in Low Profile chassis. They incorporate integrated J2 user I/O routing across the PCB to a set of intermediate D type Cannons. Additional TTL circuitry is implemented on backplanes for Power Fail Monitor functions and for driving the chassis front panel LED indicators. |
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| CM Computer © 2002 |
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| Military VMEbus Boards|
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